本报告由两大部分所组成:「产业动态议题」与「成本与价格趋势」;涵盖的范围大约是“Driver IC与其产业链中的关键主题分析”以及“Driver IC与对应的上游「Foundry」与「Package & Testing」的价格趋势与背后的影响因素议题探讨”,同时提供相关零组件市场讯息,让客户随时了解面板上游市场的最新动态。
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